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樂泰 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on aide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies.
Particularly suited where low curing temperatures are required for heat sensitivecomponents.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.6Yield Point, 25 °C, mPa•sCone & Plate Rheometer44,000Casson Viscosity @ 25 °C, mPa•s (cP)Cone & Plate Rheometer7,000 to 27,000LMSPot life @ 25 °C, weeks 3Shelf Life @ -25 to -15 °C, days 365TYPICAL CURING PERFORMANCE Recommended Curing Conditions20 minutes @ 80 °C bond line temperature60 minutes @ 60 °C bond line temperature Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.
TYPICAL PROPERTIES OF CURED MATERIAL Cured for 60 minutes @ 80 °Physical Properties Density @ 25 °C, g/cm3 1.7Volume Shrinkage, ASTM D 792, % 3.1Linear Shrinkage, ASTM D 792, % 1.0Shore Hardness, ISO 868, Udometer D 88Glass Transition Temperature, °C:(Tg) via TMA , ISO 11359-2 45Coefficient of Thermal Expansion,
樂泰 3128是熱固化環(huán)氧樹脂的一部分。
該產(chǎn)品設(shè)計為在低溫下固化，并在相當(dāng)短的時間內(nèi)在各種材料上提供優(yōu)異的附著力。典型應(yīng)用包括存儲卡，CCD / CMOS組件。特別適用于熱敏組分需要低固化溫度。
固化材料的特性：25°C 1.6°場，25°C，mPa•sCone＆板流變儀44,000Casson粘度@ 25°C，mPa•s（cP）錐＆板流變儀7000〜27000LMSPot壽命@ 25°C，周3Shelf壽命@ -25至-15°C，天365特殊固化性能推薦固化條件20分鐘@ 80°C粘 |
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