樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/樂泰 3128電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術服務熱線：021-51693135 / 021-22818476
樂泰 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on aide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies.
Particularly suited where low curing temperatures are required for heat sensitivecomponents.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.6Yield Point, 25 °C, mPa•sCone & Plate Rheometer44,000Casson Viscosity @ 25 °C, mPa•s (cP)Cone & Plate Rheometer7,000 to 27,000LMSPot life @ 25 °C, weeks 3Shelf Life @ -25 to -15 °C, days
TYPICAL PROPERTIES OF CURED MATERIAL Cured for 60 minutes @ 80 °Physical Properties Density @ 25 °C, g/cm3 1.7Volume Shrinkage, ASTM D 792, % 3.1Linear Shrinkage, ASTM D 792, % 1.0Shore Hardness, ISO 868, Udometer D 88Glass Transition Temperature, °C:(Tg) via TMA , ISO 11359-2 45Coefficient of Thermal Expansion, ISO 11359-2, K-1:alpha 1 40×10-6alpha 2 130×10-6Water Absorption, ISO 62, %:24 hours in water @ 23 °C 0.17Elongation, at break, ISO 527-3, % 2.3StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling. Optimal Storage: -15 °C to -25 °C. Storage below minus (-)25 °Cor greater than minus (-)15 °C can adversely affect product properties.
樂泰 3128是熱固化環(huán)氧樹脂的一部分。
該產(chǎn)品設計為在低溫下固化，并在相當短的時間內在各種材料上提供優(yōu)異的附著力。典型應用包括存儲卡，CCD / CMOS組件。特別適用于熱敏組分需要低固化溫度。
固化材料的特性：25° |
免責聲明：以上所展示的信息由會員自行提供，內容的真實性、準確性和合法性由發(fā)布會員負責，www.qy6.com對此不承擔任何責任。如有侵犯您的權益，請來信通知刪除。