樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/樂(lè)泰 3609電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰 3609 is designed for the bonding of surface mounted
devices to printed circuit boards prior to wave soldering.
Particularly suited for applications where medium to high
dispense speeds, high dot profile, high wet strength and good
electrical characteristics are required. 樂(lè)泰 3609 has been
used successfully in lead free processes with water and
alcohol based fluxes under conditions outlined in the
Environmental Resistance section.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.2
Particle Size, μm <150
Flash Point - See SDS
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 700LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
0.16 to 2.0
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity
curve as measured using a Haake rotoviscometer PK100,
M10/PK1 2° Cone system at a shear rate of 2 s
-1 which is
representative of the shear rate in the dispense nozzle.
Increased cabin or nozzle temperature in the 30°C to 35°C
range may aid dispense performance at higher dispense
speeds. Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than
8 °C can adversely affect product properties.
樂(lè)泰 3609設(shè)計(jì)用于表面貼裝
設(shè)備到波峰焊前的印刷電路板。
特別適用于中至高的應(yīng)用
分配速度快，圓點(diǎn)狀，高濕強(qiáng)度好
需要電氣特性。 樂(lè)泰 3609已經(jīng)
成功用于無(wú)鉛流程與水和
醇基助焊劑在條件下概述
環(huán)保部分。
固化材料的典型特性
比重@ 25°C 1.2
粒度，μm<150
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