HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/HYSOL FP4451TD電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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PRODUCT DESCRIPTION
Hysol® FP4451TD (FP0105) is a high purity, liquid dammingmaterial. It featuresa cured aspect ratio of 0.70 (height/width).It is based on Hysol® FP4450 resin chemistry, thereforeexhibiting excellent chemical resistance and thermal stabilityproperties. This material is designed for temperature cyclingranges up to –65°C to 150°C. FP4451TD utilizes silica fillerwith a median particle size of 20 microns; its maximum particlesize is 200 microns.
TYPICAL APPLICATIONS
Encapsulant for damming
PROPERTIES OF UNCURED MATERIAL
Color Black
Filler content, %, (ITM3A) 73
Specific Gravity (ITM9A) 1.79
Shelf Life @-40°C, (-40°F), months 9
Typical Value
Viscosity @ 25°C, (77°F)
(ITM2A)
Brookfield RVF
Spindle 7, Speed 2, cP 900,000
Spindle 7, Speed 20, cP 300,000
PHYSICAL PROPERTIES, CURED MATERIAL
Color Black
Aspect Ratio (H/W) 0.70
Glass Transition (Tg), °C (ITM65B Tg= 150 °C
Coefficient of Linear Thermal Expansion,
In/in/°C (ITM65B)
α1 (40-120°C) CTE=21x 10-6
α2 (190-220°C) CTE=76 x 10-6
Filler Content, % 73.0
Extractable Ionic Content, (ITM107B)
Chloride (Cl-), ppm <10
Sodium (Na+), ppm <1
Potassium (K+), ppm <1
Handling
Gel Time @ 121°C, (250°F), minutes, 13 (ITM10N)
Pot Life @ 25°C, (77°F), days 10
FP4451TD must be completely cured in order to achieveoptimum properties. Use suggested cure schedules asgeneral guidelines; other cure schedules may yield satisfactoryresults.
產品描述
Hysol®FP4451TD（FP0105）是一種高純度液體阻隔材料。它的固化長寬比為0.70（高/寬）。因此，它基于Hysol®FP4450樹脂化學表現出優(yōu)異的耐化學性和熱穩(wěn)定性
屬性。該材料專為溫度循環(huán)而設計
范圍可達-65°C至150°C |
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