ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/ECCOBOND 8177-0電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ECCOBOND 8177-0 is designed for chip attach applications. Itallows the product to be used with thermally sensitive deviceswithout damaging the assembly.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
D = 1.5 Pa.s 65,000
D = 15 Pa.s 13,000
Thixotropic Index 5.0
Specific Gravity 3.9 to 4.0
Work Life @ 25°C, hours 36
Shelf Life @ -40°C, year 1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
Hot Plate:
6 minutes @ 130°C or
4 minutes @ 150°C
Convection:
10 minutes @ 150°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -40 °C
ECCOBOND 8177-0專為芯片連接應(yīng)用而設(shè)計(jì)。它允許產(chǎn)品與熱敏設(shè)備一起使用而不損壞組件。
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
D = 1.5 Pa.s 65,000
D = 15 Pa.s 13,000
觸變指數(shù)5.0
比重3.9〜4.0
工作生活@ 25°C，小時(shí)36
保質(zhì)期@ -40°C，第1年
閃點(diǎn) - 參見MSDS
典型的固化性能
治愈時(shí)間表
熱板：
在130°C或6分鐘
150°C 4分鐘
對(duì)流：
150°C 10分鐘
以上治療方案是指導(dǎo)性建議。治愈條件（時(shí)間和溫度）可能會(huì)有所不同客戶的經(jīng)驗(yàn)和應(yīng)用要求以及客戶固化 |
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