漢高漢高樂(lè)泰樂(lè)泰 貼片紅膠Chipbond 3621
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰 3621
樂(lè)泰 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. 樂(lè)泰 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.22
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
130 to 280LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
0.5 to 3
Particle Size, μm <150
Flash Point - See SDS
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity curve as measured using a Haake rotoviscometer PK100, M10/PK1 2° Cone system at a shear rate of 2 s -1 which is representative of the shear rate in the dispense nozzle. Increased cabin or nozzle temperature in the 30°C to 35°C range may aid dispense performance at higher dispense speeds.
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K) 0.3
Density, BS 5350-B1 @ 25 °C, g/cm3 1.16
Glass Transition Temperature, ASTM D 4065, °C 110
樂(lè)泰 3621
樂(lè)泰 3621是設(shè)計(jì)表面安裝器件接for the prior to to印制電路板波焊錫。特別是在非常高的suited for應(yīng)用提供高速、高濕強(qiáng)度點(diǎn)輪廓，和良好的電氣特性是必需的。特別是在速大于35000 suited提供嫁妝/ H are required。用樂(lè)泰 3621 has been successfully鉛自由過(guò)程以及水和醇基通量條件下部分概述in the環(huán)境阻力。
uncured材料的典型性能
比重：25℃1.22
屈服點(diǎn)，25℃，PA
平錐與血流計(jì)：
Haake PK 100，M10 / PK 1 2°錐
280lms 130 to
卡森粘度”25°C，pa∙s
平錐與血流計(jì)：
Haake PK 100，M10 / PK 1 2°錐0.5～3
顆粒尺寸，μ＜15
See SDS閃光點(diǎn)
粘度與溫 |
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