ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/ECCOBOND DX-10C電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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ECCOBOND DX-10C is a thermosetting, dielectricadhesive developed for GaN blue and white LED chip bonding. It features strong heat / UV resistance and can be applied bypin transfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
Speed 10 rpm 3,000
Work Life, hours 4
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 140°C
Time shown does not include ramp-up time to cure temperaure.The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -20 °C
ECCOBOND DX-10C是一種熱固性電介質(zhì)粘合劑開發(fā)用于GaN藍(lán)色和白色LED芯片接合。它具有強(qiáng)的耐熱/耐紫外線性，可以應(yīng)用針轉(zhuǎn)印，沖壓和分配。
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
速度10 rpm 3,000
工作時(shí)間4小時(shí)
保質(zhì)期@ -20°C，月6
閃點(diǎn) - 參見MSDS
典型的固化性能
治愈時(shí)間表
1小時(shí)@ 140°C
顯示的時(shí)間不包括加溫時(shí)間來(lái)治愈溫度。以上治療方案是指導(dǎo)性建議。治愈條件（時(shí)間和溫度）可能會(huì)有所不同客戶的經(jīng)驗(yàn)和應(yīng)用要求以及客戶固化設(shè)備，烤箱裝載和實(shí)際烘箱溫度。
存儲(chǔ) 將產(chǎn)品存放在未開封的容器 |
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