樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/樂泰 384電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術服務熱線：021-51693135 / 021-22818476
樂泰 384 is a thermally conductive adhesive systemdesigned for bonding heat generating components to heat sinks.
The high thermal conductivity provides excellent heatdissipation for thermally sensitive components, while thecontrolled strength permits field and service repair.
In high potapplications this product should be limited to a maximum of500 volts. Typical applications include bonding transformers,transistors and other heat generating electronic components toprinted circuit board assemblies or heat sinks.
TYPICAL PROPERTIES OF UNCURED MATERIALSpecific Gravity @ 25 °C 1.64Flash Point - See SDSViscosity, Brookfield - HBT, 25 °C, mPa•s (cP):
Spindle TE, speed 2.5 rpm, , Helipath 500,000 to 2,250,000LMSSpindle TE, speed 20 rpm, Helipath 300,000 to 800,000LMSTYPICAL PROPERTIES OF CURED MATERIALPhysical PropertiesCoefficient of Thermal Expansion,ISO 11359-2, K-169×10-6Coefficient of Thermal Conductivity, ISO 8302,W/(m•K)0.757Elongation, at break, ISO 527-3, % 0.9Tensile Strength, at break, ISO 527-3 N/mm2 13(psi) (1,800)Young's Modulus N/mm2 2,800 (psi) (400,000)Electrical PropertiesVolume Resistivity, IEC 60093, Ω•cm 1.3×1012Surface Resistivity, IEC 60093, Ω 5.1×1013Dielectric Breakdown Strength, IEC 60243-1, kV/mm 26.7Dielectric Constant / Dissipation Factor, IEC 60250:100-Hz 6.48 / 0.11-kHz 5.86 / 0.041-MHz 5.22 / 0.03 StorageStore product in the unopened container in a dry location.
樂泰 384是一種熱傳導粘合劑系統(tǒng)，用于將發(fā)熱部件粘合到加熱中水槽高導熱性為熱敏元件提供出色的散熱性，而受控的強度允許現(xiàn)場和維修。
在高應用中， |
免責聲明：以上所展示的信息由會員自行提供，內容的真實性、準確性和合法性由發(fā)布會員負責，www.qy6.com對此不承擔任何責任。如有侵犯您的權益，請來信通知刪除。