樂(lè)泰 315電子組裝樂(lè)泰 315電子組裝//樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝/樂(lè)泰 315電子組裝
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樂(lè)泰®315™ is a self-shimming thermally conductive, one part adhesive for bonding electrical components to heat sinks with an insulating gap.
The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair.
The self-shimming property produces a consistent 5-6 mil gap between the component and the heat sink.
This gap results in electrical insulation while maintaining thermal conductivity.
Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks. In high pot applications this product should be limited to a maximum of 500 volts.
Activator 7387™ is required for proper curing. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.66Flash Point - See MSDS Viscosity, Brookfield - HBT, 25 °C, mPa•s (cP):Spindle TF, speed 20 rpm, Helipad 360,000 to 850,000LMS
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion, ASTM D 696, K -1 69×10-6Coefficient of Thermal Conductivity, ASTM C177,W/(m•K)0.808Elongation, at break, ISO 527, % 1 Tensile Strength, at break, ISO 527 N/mm2 15.0 (psi) (2,180)Young's
樂(lè)泰®315™是一種自我補(bǔ)片導(dǎo)熱，一次性粘合劑，用于將電氣部件連接到具有絕緣間隙的散熱片。
高熱導(dǎo)率為熱敏元件提供了優(yōu)異的散熱性能，同時(shí)受控的強(qiáng)度可以實(shí)現(xiàn)現(xiàn)場(chǎng)維修和維修。
自勻整特性在組件和散熱片之間產(chǎn)生一致的5-6密耳間隙。
該間隙導(dǎo)致電絕緣，同時(shí)保持導(dǎo)熱性。典型應(yīng)用包括接合變壓器，晶體管和其他發(fā)熱電子部件到印刷電路板組件或散熱片。
在高鍋應(yīng)用中，產(chǎn)品應(yīng)限制在*大500伏特。需要7387™的激活劑才能正 |
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