漢高漢高樂(lè)泰樂(lè)泰 UF 3800
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰 ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Physica MCR100 @ 25°C, mPa∙s (cP):
Spindle CP50-1, Shear Rate 100s
-1 375
Specific Gravity 1.13
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, days 274
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
≥8 minutes @ 130°C
The above cure schedules represent actual bondline/material temperatures.
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties :
Coefficient of Thermal Expansion ppm/°C:
Below Tg, ppm/°C 52
Above Tg, ppm/°C 188
Glass Transition Temperature (Tg) by TMA, °C 69
Storage Modulus, 25°C, GPa 3.08
Electrical Properties:
Dielectric Constant @ 23oC :
@ 1GHz 2.97
@ 2GHz 2.8
Dissipation Factor @ 23oC:
@ 1GHz 0.0174
@ 2GHz 0.0022
樂(lè)泰eccobond UF 3800返修的環(huán)氧填充用于CSP、BGA應(yīng)用。它在溫和的溫度下迅速固化，以盡量減少對(duì)其他部件的應(yīng)力，當(dāng)固化提供了良好的機(jī)械應(yīng)力保護(hù)焊點(diǎn)。
固化材料的典型性能
粘度、物理mcr100 @ 25°C，MPA∙S（CP）：
主軸cp50-1，剪切速率100s
375 - 1
比重1.13
鍋生活@ 25oC，3天
保質(zhì)期@ 20°C，天274
閃點(diǎn)-見(jiàn)SDS
典型的固化性能
治療計(jì)劃
≥8分鐘@ 130°C
上述治療計(jì)劃代表實(shí)際的膠層/材料溫度。
上面的固化輪廓是指南推薦。固化條件（時(shí)間和溫度）可能會(huì)根據(jù)客戶的經(jīng)驗(yàn)和他們的應(yīng)用要求，以及客戶固化設(shè)備，烘箱負(fù)荷和實(shí)際烤箱溫度變化。
固化材料的典型性能
物理性質(zhì)：
熱膨脹系數(shù)°ppm / C：
低于Tg，PPM /°C 52
Tg以上，PPM /°C 188
玻璃化轉(zhuǎn)變溫度（Tg）通過(guò)TMA，°C 69
儲(chǔ)能模量， |
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