漢高漢高樂泰樂泰 UF 3800
技術服務熱線：021-51693135 / 021-22818476
樂泰 ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Physica MCR100 @ 25°C, mPa∙s (cP):
Spindle CP50-1, Shear Rate 100s
-1 375
Specific Gravity 1.13
Pot Life @ 25oC, days 3
Shelf Life @ -20°C, days 274
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
≥8 minutes @ 130°C
The above cure schedules represent actual bondline/material temperatures.
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties :
Coefficient of Thermal Expansion ppm/°C:
Below Tg, ppm/°C 52
Above Tg, ppm/°C 188
Glass Transition Temperature (Tg) by TMA, °C 69
Storage Modulus, 25°C, GPa 3.08
Electrical Properties:
Dielectric Constant @ 23oC :
@ 1GHz 2.97
@ 2GHz 2.8
Dissipation Factor @ 23oC:
@ 1GHz 0.0174
@ 2GHz 0.0022
樂泰eccobond UF 3800返修的環(huán)氧填充用于CSP、BGA應用。它在溫和的溫度下迅速固化，以盡量減少對其他部件的應力，當固化提供了良好的機械應力保護焊點。
固化材料的典型性能
粘度、物理mcr100 @ 25°C，MPA∙S（CP）：
主軸cp50-1，剪切速率100s
375 - 1
比重1.13
鍋生活@ 25oC，3天
保質期@ 20°C，天274
閃點-見SDS
典型的固化性能
治療計劃
≥8分鐘@ 130°C
上述治療計劃代表實際的膠層/材料溫度。
上面的固化輪廓是指南推薦。固化條件（時間和溫度）可能會根據客戶的經驗和他們的應用要求，以及客戶固化設備，烘箱負荷和實際烤箱溫度變化。
固化材料的典型性能
物理性質：
熱膨脹系數°ppm / C：
低于Tg，PPM /°C 52
Tg以上，PPM /°C 188
玻璃化轉變溫度（Tg）通過TMA，°C 69
儲能模量， |
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