環(huán)氧膠 漢高漢高 樂(lè)泰樂(lè)泰 3128
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰 3128
樂(lè)泰 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies. Particularly suited where low curing temperatures are required for heat sensitive components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.6
Yield Point, 25 °C, mPa·s
Cone & Plate Rheometer
44,000
Casson Viscosity @ 25 °C, mPa·s (cP)
Cone & Plate Rheometer
7,000 to 27,000LMS
Pot life @ 25 °C, weeks 3
Shelf Life @ -25 to -15 °C, days 365
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
20 minutes @ 80 °C bondline temperature
60 minutes @ 60 °C bondline temperature
Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 60 minutes @ 80 °C
Physical Properties
Density @ 25 °C, g/cm3 1.7
Volume Shrinkage, ASTM D 792, % 3.1
Linear Shrinkage, ASTM D 792, % 1.0
Shore Hardness, ISO 868, Durometer D 88
Glass Transition Temperature, °C:
(Tg) via TMA , ISO 11359-2 45
Coefficient of Thermal Expansion,
ISO 11359-2, K-1:
alpha 1 40×10-6
alpha 2 130×10-6
Water Absorption, ISO 62, %:
24 hours in water @ 23 °C 0.17
Elongation, at break, ISO 527-3, % 2.3
樂(lè)泰3128
樂(lè)泰3128是一一部分，熱固化環(huán)氧樹(shù)脂。本產(chǎn)品的目的是在低溫下固化，并在相當(dāng)短的時(shí)間內(nèi)提供了良好的附著力在廣泛的材料。典型的應(yīng)用包括記憶卡，CCD或CMOS組件。特別適合于低固化溫度所需的熱敏元件。
固化材料的典型性能
比重@ 25°C 1.6
屈服點(diǎn)，25°C，MPa
錐板流變儀
四萬(wàn)四千
卡森粘度@ 25°C，MPA•S（CP）
錐板流變儀
7000 27000lms
鍋壽命@ 25°C，周3
保質(zhì)期@ 25至15°C，第365天
典型的固化性能
推薦固化條件
20分鐘@ 80°膠層溫度C
60分鐘@ 60°膠層溫度C
注：必須添加足夠的時(shí) |
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