eight layers of high frequency mixed pressure + buried HDI products High Frequency PCB taconic pcb
Product Description
Product area: optical module buried
Number of layers: 8LHDI second order
Plate thickness: 1.60mm
Process structure: 3m+ buried resistance + FR-4TG170Impedance Ω ± 10%,line width line spacing 3/3mil, resin plug hole + copper fill hole,Buried + buried
Buried + minimum hole 0.20mm
Surface treatment: Shen Jin 3u"
Quantities range from prototype to volume production.
100% E-Test
vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging
Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure |
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