ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/ECCOBOND A316-48電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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ECCOBOND A316-48 is an oxide filled, pourable epoxy adhesive designed for use in harsh automotive applications.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity, Brookfield , mPa•s (cap) 50,000
Specific Gravity 1.4Shelf Life @ 25°C, months 3Flash Point - See MSDSTYPICAL CURING PERFORMANCE Cure Schedule30 minutes @ 100°C or5 minutes @ 120°C or3 minutes @ 140°C or1 minutes @ 160°CPost Cure2 to 4 hours at the highest expected use temperature The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion ISO 11359-2:Below Tag, pap/°C 55 Above Tag, pap/°C 155Glass Transition Temperature, ISO 11357-2, °C 145Thermal Conductivity, W/mk 0.4 mHardness Shore D:@ 25oC 86@ 130oC 40Electrical Properties: Volume Resistivity, ohms-cm:@ 25oC 1×1015 @ 130oC 3×1013Dielectric Constant IEC 60250:1kHz 3.75TYPICAL PERFORMANCE OF CURED MATERIAL Tensile Strength :Aluminum @ 25oC N/mm2 17.3 (psi) (2,500)Storage Store product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.
Optimal Storage: 25 °C
ECCOBOND A316-48是一種氧 |
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