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膠水公司
| 聯(lián)系人：王小姐
女士 (主管) |
| 電 話：021-22818476 |
手 機(jī)：13052326431  |
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| 樂(lè)泰 5404電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠 |
樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/樂(lè)泰 5404電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
SI 5404™ is designed to bond metallic heat sinks, ceramicchips and circuit board substrates.
SI 5404™ applicationsinclude the bonding of various heat generating devices (powerdevices) to their respective heat sinks.
The adhesive isdesigned to provide a strong bond between the device and itsheat sink as well as low resistance to the flow of heat from theelectronic device to the heat sink.
This will help maintain aconsistent dispersion of the conductive filler within the adhesivematrix.Suggested minimum heat cure conditions for either IR or convectionoven: 10 minutes at 150°C or 15 minutes at 130°C.
All times givenabove are exclusive of heat up rate. It is essential that the bond linesattain these temperatures for the stated times.
Cure rate is verydependent on the oven type used, the size and geometry of the partsbeing bonded as well as their composition.
StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 2 °C to 8 °C.
Storage below 2 °C orgreater than 8 °C can adversely affect product properties.
SI 5404™設(shè)計(jì)用于粘接金屬散熱器，陶瓷芯片和電路板基板。
SI 5404™應(yīng)用包括將各種發(fā)熱設(shè)備（電力設(shè)備）連接到各自的散熱器。
粘合劑被設(shè)計(jì)成在裝置和其熱槽之間提供牢固的結(jié)合，以及對(duì)從電子 |
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