樂泰 3874電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂泰 3874 is a thermally conductive adhesive. When usedwith Activator 7387™, it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer.
Typicalapplications include bonding heat sinks to heat dissipatingcomponents such as BGAs in electronics applications. Thethixotropic nature of 樂泰 3874 reduces the migration ofliquid product after application to the substrate.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 2.08Flash Point - See SDSViscosity, Brookfield - HBT, 25 °C, mPa•s (cP):Spindle TB, speed 0.5 rpm, Helipath 800,000 to 1,800,000LMSSpindle TB, speed 5 rpm, Helipath 200,000 to 450,000LMS Cure Speed vs. SubstrateThe rate of cure will depend on the substrate used. The graphbelow shows the shear strength developed with time on gritblasted steel lap shears and tested according to ISO 4587.(Activator 7387™ applied to one surface).
StorageStore product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than8 °C can adversely affect product properties.
樂泰 3874是導(dǎo)熱粘合劑。
當(dāng)與Activator 7387™一起使用時(shí)，它可快速固化，形成高溫強(qiáng)度，高模量，熱固性丙烯酸聚合物。
典型應(yīng)用包括將散熱片連接到散熱部件，如電子應(yīng)用中的BGA。
樂泰 3874的觸變性降低了應(yīng)用于基材后液體產(chǎn)品的遷移。
固化材料的特性比重@ 25°C 2.08閃點(diǎn) - 參見SDSViscosity，Brookfield - HBT，25°C，mPa•s（cP）：主軸TB，轉(zhuǎn)速0.5 rpm，Helipath 800,000至1,800,000LMS主軸TB，轉(zhuǎn)速5 rpm，Helipath 20萬至45萬LMS固化速度與底物固化速率取決于所用的底物。
曲線圖顯示了經(jīng)過噴砂鋼絞線剪切力隨時(shí)間推移的剪切強(qiáng)度，并根據(jù)ISO 4587測(cè)試（活化劑7387™應(yīng)用于一個(gè)表面）。
StorageStore產(chǎn)品在未開封的容器中干燥處。
存儲(chǔ)信息可能在產(chǎn)品容器標(biāo)簽上顯示。
*佳儲(chǔ)存：2°C至8°C。低于2°C或高于8°C的儲(chǔ)存可能會(huì)對(duì)產(chǎn)品性能產(chǎn)生不利影響 |
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