HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/HYSOL ES2500電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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HYSOL®ES2500™ is a resilient, low cost, fast gelling, pottingcompound.
Designed for easy 2 to 1 meter-mix-dispense machinery and low abrasion.
This material is ideal for potting and encapsulating high volume parts.HYSOL®ES2500™ meets UL 94 HB Flame Retardant to1.5mm thickness.
TYPICAL PROPERTIES OF UNCURED MATERIAL Part A Properties Density, @ 25 °C, g/cm3 1.63Viscosity @ 25 °C, cP 11,000Part B Properties Density, @ 25 °C, g/cm3 0.97Viscosity @ 25 °C, cP 170Mixed Properties Density, @ 25 °C, g/cm3 1.41Viscosity @ 25 °C, cP 1,500Pot Life @ 25 °C, minutes:400 g mass 10Gel Time @ 25 °C, minutes:400 g mass 25TYPICAL CURING PERFORMANCE Recommended Curing Conditions16 hours @ 25 °C (Recommended cure)2 hours @ 66 °C (Alternate cure)
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Glass Transition Temperature, °C 2Coefficient of Thermal Expansion, ppm/oC:Pre Tg (Alpha 1) 65Post Tg (Alpha 2) 150Thermal Conductivity, W/mk 0.288Shore Hardness , Udometer D 7024 Hour Water Moisture Absorption, % 0.3Tensile Strength, psi 1,300Exotherm Temp, 300 grams @ oC 102 Storage Store product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.Liquid Storage - Liquids should be stored at 23°C or below, in closed containers.
If stored below 23°C, the material MUST be allowed to come to room temperature, in the sealed container, to avoid moisture contamination.
HYSOL®ES2500™是一種具有彈性，低成本，快速凝膠化，灌封的化 |
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