漢高漢高樂泰樂泰 樂泰 HHD 4042
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ECCOBOND CT4042-1 A/B is a silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in microelectronic applications. ECCOBOND CT4042- 1 A/B is the lower viscosity version of ECCOBOND CT4042 adhesive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Part A Properties CT4042-1A:
Viscosity, mPa•s (cP) 110,000
Density , g/cm3 2.35
Flash Point - See MSDS
Part B Properties CT4042-1B:
Viscosity, mPa•s (cP) 75,000
Density , g/cm3 3.4
Flash Point - See MSDS
Mixed Properties :
Pot life @ 25 °C, 20gram mixture, days 4
Shelf Life @ 18 to 25°C (from date of manufacture), year 1
TYPICAL CURING PERFORMANCE
Cure Schedule
120minutes @ 80°C
30minutes @ 120°C
15minutes @ 150°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
eccobond ct4042-1 A / B是一個銀填充，易于應用，環(huán)氧導電膠粘劑。建議在微電子應用芯片粘接。eccobond ct4042 - 1 A / B是eccobond ct4042膠粘劑粘度較低版本。
固化材料的典型性能
部分的性能ct4042-1a：
粘度，兆帕S（CP）110000
密度，克/厘米2.353
閃光點看到MSDS
B部分性能ct4042-1b：
粘度，兆帕S（CP）75000
密度，克/厘米3.43
閃光點看到MSDS
混合性能：
鍋生活@ 25°C，20gram混合物，4天
保質(zhì)期@ 18至25°C（從制造日期），第1年
典型的固化性能
治療計劃
120minutes @ 80°C
30minutes @ 120°C
15minutes @ 150°C
上述固化型材指南建議。固化條件（時間和溫度）可能會根據(jù)客戶的經(jīng)驗和他們的應用要求，以及客戶固化設備，烘箱負荷和實際烤箱溫度變化。 |
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