漢高漢高樂(lè)泰樂(lè)泰 3119
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰 ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1 to 1.3LMS
Yield Point, 25 °C, mPa•s
Cone & Plate Rheometer
10,000 to 38,000LMS
Casson Viscosity @ 25 °C, mPa•s (cP)
Cone & Plate Rheometer
7,000 to 23,000LMS
Pot life @ 25 °C, weeks 3
TYPICAL CURING PERFORMANCE
Recommended Curing Conditions
60 minutes @ 100 °C bondline temperature
120 minutes @ 75 °C bondline temperature
Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 60 minutes @ 100 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm2 24
(psi) (3,500)
Epoxyglass (thickness 1.6 mm) N/mm2 ≥10LMS
(psi) (≥1,450)
TYPICAL ENVIRONMENTAL RESISTANCE
Cured for 60 minutes @ 100 °C
Lap Shear Strength, ISO 4587:
Epoxy glass (thickness 1.6 mm
樂(lè)泰 ABLESTIK治愈3119迅速在相對(duì)低的溫度下，提供一系列優(yōu)越的附著力。典型應(yīng)用包括組裝的電子元件是熱敏。
固化材料的典型性能
比重@ 25°C 1.1 1.3lms
屈服點(diǎn)，25°C，MPa•s
錐板流變儀
10000 38000lms
卡森粘度@ 25°C，MPA•S（CP）
錐板流變儀
7000 23000lms
鍋壽命@ 25°C，周3
典型的固化性能
推薦固化條件
60分鐘@ 100°膠層溫度C
120分鐘@ 75°膠層溫度C
注：必須添加足夠的時(shí)間，以允許鍵的位置，以達(dá)到所需的固化溫度。固化配置應(yīng)開(kāi)發(fā)為每個(gè)設(shè)備。
固化材料的典型性能
治愈60分鐘@ 100°C
物理性質(zhì)：
密度@ 25°C，克/厘米1.23
邵氏硬度、ISO 868，Durometer D 87
玻璃化轉(zhuǎn)變溫度：
（TG）DMA，ASTM E 1640 110
熱膨脹系數(shù)，
ISO 11359-2，K-1：
α1 65×10-6
α2 210×10-6
吸水率，ISO 62，%：
24小時(shí)水中@ 23°C 0.36
伸 |
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