漢高漢高樂(lè)泰樂(lè)泰 3707
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰 3707 UV curable edgebond is designed for bonding various types of electronic components on a PCB.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP52, 25 °C, mPa•s (cP):
Speed 20 rpm 9,595
Pot Life @ 25oC, days <7
Shelf Life - Refer to package label
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended UV Cure
>3,000mJ or
>30 seconds @ 100 mW/cm2
Cure Depth, mm:
MPHL (UVALoc1000) at 100 mW/cm2, for 30 seconds ≥10
Oven Cure
2 minute @ 130°C
Minimum intensity of 100 mW/cm2 is recommended for the UV lamp. Use suggested cure schedules as general guidelines; other cure schedules may yield satisfactory results.
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Specimen was prepared by thermal cure only
Physical Properties
Coefficient of Thermal Expansion , ppm/°C:
Below Tg 52
Above Tg 151
Glass Transition Temperature (Tg) by TMA, °C 53
Storage Modulus, GPa 4.4
樂(lè)泰3707 UV edgebond設(shè)計(jì)結(jié)合各類(lèi)電子元件在PCB。
固化材料的典型性能
粘度，Brookfield cp52，25°C，MPA•S（CP）：
速度20轉(zhuǎn)9595
鍋生活@ 25oC、d＜7
貨架壽命-參考包裝標(biāo)簽
閃點(diǎn)-見(jiàn)SDS
典型的固化性能
推薦固化
> 3000mj或
> 30秒@ 100毫瓦/厘米2
固化深度，采購(gòu)經(jīng)理：
MPHL（uvaloc1000）在100毫瓦/厘米2，30秒≥10
烘箱中固化
2分鐘@ 130°C
*小強(qiáng)度為100毫瓦/厘米2推薦用于紫外燈。使用建議的治療時(shí)間表作為一般指導(dǎo)方針，其他治療方案可能會(huì)產(chǎn)生令人滿(mǎn)意的結(jié)果。
上述固化型材指南建議。固化條件（時(shí)間和溫度）可能會(huì)根據(jù)客戶(hù)的經(jīng)驗(yàn)和他們的應(yīng)用要求，以及客戶(hù)固化設(shè)備，烘箱負(fù)荷和實(shí)際烤箱溫度變化。
固化材料的典型性能
標(biāo)本僅通過(guò)熱固化制備
物理性質(zhì)
熱膨脹系數(shù)，PPM /°C：
在Tg 52
在Tg 151
玻璃化轉(zhuǎn)變溫度（Tg）通過(guò)TMA，°C 53
儲(chǔ)能模 |
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